2024

• Ockel M., Gökçen A., Ottinger B., Petersen M., Voigt C., Franke J.:
  Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering
  International Thermal Spray Conference and Exposition (Mailand, 29. April 2024 - 1. Mai 2024)
  In: ITSC 2024 International Thermal Spray Conference and Exposition. Conference Proceedings and Poster Sessions, Düsseldorf: 2024
  BibTeX: Download
• Utsch D., Sippel M., Voigt C., Häußler F., Franke J.:
  Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication
  In: Power Electronic Devices and Components 8 (2024), Art.Nr.: 100067
  ISSN: 2772-3704
  DOI: 10.1016/j.pedc.2024.100067
  BibTeX: Download

2023

• Utsch D., Häußler F., Voigt C., Sippel M., Franke J.:
  Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
  46th International Spring Seminar on Electronics Technology (Timisoara, 10. Mai 2023 - 14. Mai 2023)
  DOI: 10.1109/ISSE57496.2023.10168526
  BibTeX: Download
• Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
  Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
  International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
  In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
  DOI: 10.1109/ISSE57496.2023.10168387
  BibTeX: Download

2022

• Kirchberger M., Heeger M., Altay A., Liebrecht C., Overbeck L., Kandler M., Lanza G., Voigt C., Franke J.:
  Simulationsgestütztes Vorgehensmodell zur Realisierung einer Matrixfertigung
  In: Zeitschrift Kunststofftechnik 117 (2022), S. 224-228
  ISSN: 1864-2217
  DOI: 10.1515/zwf-2022-1037
  BibTeX: Download
• Thielen N., Pan W., Piechulek N., Voigt C., Meier S., Schmidt K., Franke J.:
  Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013210
  BibTeX: Download

2021

• Schmidt K., Rauchensteiner D., Voigt C., Thielen N., Bönig J., Beitinger G., Franke J.:
  An Automated Optical Inspection System for PIP Solder Joint Classification Using Convolutional Neural Networks
  2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (San Diego, CA, 1. Juni 2021 - 4. Juli 2021)
  In: IEEE (Hrsg.): IEEE 2021
  DOI: 10.1109/ECTC32696.2021.00346
  URL: https://ieeexplore.ieee.org/document/9501916
  BibTeX: Download
• Thielen N., Jiang Z., Schmidt K., Seidel R., Voigt C., Reinhardt A., Franke J.:
  Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing
  IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Timisoara)
  In: 2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021), NEW YORK: 2021
  DOI: 10.1109/SIITME53254.2021.9663663
  BibTeX: Download
• Voigt C., Hagag A., Kirchberger M., Franke J.:
  Evaluation of Influences on Accuracy of Radiographic Measurements of Solder Joint Volume
  44th International Spring Seminar on Electronics Technology, ISSE 2021 (Bautzen, DEU, 5. Mai 2021 - 9. Mai 2021)
  In: Proceedings of the International Spring Seminar on Electronics Technology 2021
  DOI: 10.1109/ISSE51996.2021.9467562
  BibTeX: Download
• Voigt C., Harnecker L., Kirchberger M., Franke J.:
  An Analysis of Redundancy in High Volume High Mix Quality Testing Systems in Electronics Production
  44th International Spring Seminar on Electronics Technology, ISSE 2021 (Bautzen, DEU, 5. Mai 2021 - 9. Mai 2021)
  In: Proceedings of the International Spring Seminar on Electronics Technology 2021
  DOI: 10.1109/ISSE51996.2021.9467650
  BibTeX: Download

2020

• Schmidt K., Thielen N., Voigt C., Seidel R., Franke J., Milde Y., Bonig J., Beitinger G.:
  Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292292
  BibTeX: Download
• Seidel R., Hassan Amada M., Fuchs J., Thielen N., Schmidt K., Voigt C., Franke J.:
  Data Mining System Architecture for Industrial Internet of Things in Electronics Production
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292282
  BibTeX: Download
• Seidel R., Thielen N., Schmidt K., Voigt C., Franke J.:
  Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors
  2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. Oktober 2020 - 24. Oktober 2020)
  In: IEEE (Hrsg.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
  DOI: 10.1109/SIITME50350.2020.9292175
  BibTeX: Download
• Seidel R., Thielen N., Voigt C., Franke J.:
  Thermische Beurteilung von THT-Lötstellendesigns für die IPC-konforme Kontaktierung durch Selektivwellenlöten
  EBL 2020 (Fellbach, 18. Februar 2020 - 19. Februar 2020)
  BibTeX: Download
• Seidel R., Volland J., Thielen N., Voigt C., Franke J.:
  Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement
  ISSE 2020
  DOI: 10.1109/ISSE49702.2020.9120918
  BibTeX: Download
• Voigt C., Franke J.:
  Evaluation verschiedener Ansätze zur vollautomatisierten Montage von Weicheisenkernen auf Flachbaugruppen in traditionellen SMD-Linien
  EBL 2020 – Elektronische Baugruppen und Leiterplatten - 10. DVS/GMM-Tagung (Fellbach, 18. Februar 2020 - 19. Februar 2020)
  In: EBL 2020 - Elektronische Baugruppen und Leiterplatten 2020
  BibTeX: Download