2024

• Ockel M., Borchers A., Fröhlich J., Petersen M., Paschen T., Christiansen S., Franke J.:
  Atmospheric Plasma Spraying for Copper Coating of Ceramic Solid Electrolytes for Anode-Free Solid-State Batteries with Increased Interfacial Contact
  2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS) (Bamberg, 5. Juni 2024 - 6. Juni 2024)
  In: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS) 2024
  DOI: 10.1109/EPTS61482.2024.10586742
  BibTeX: Download
• Ockel M., Gökçen A., Ottinger B., Petersen M., Voigt C., Franke J.:
  Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering
  International Thermal Spray Conference and Exposition (Mailand, 29. April 2024 - 1. Mai 2024)
  In: ITSC 2024 International Thermal Spray Conference and Exposition. Conference Proceedings and Poster Sessions, Düsseldorf: 2024
  BibTeX: Download

2023

• Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
  Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
  International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
  In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
  DOI: 10.1109/ISSE57496.2023.10168387
  BibTeX: Download

2019

• Sippel M., Lomakin K., Ankenbrand M., Petersen M., Franke J., Helmreich K., Vossiek M., Gold G.:
  3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy
  28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019) (Montreal)
  DOI: 10.1109/EPEPS47316.2019.193232
  BibTeX: Download

2018

• Ankenbrand M., Scheetz M., Franke J., Lomakin K., Sippel M., Gold G., Helmreich K.:
  Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
  2018 13th International Congress Molded Interconnect Devices (MID)
  DOI: 10.1109/ICMID.2018.8527052
  BibTeX: Download
• Gräf D., Neermann S., Stuber L., Scheetz M., Franke J.:
  Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures
  In: 2018 13th International Congress Molded Interconnect Devices (MID) 2018
  DOI: 10.1109/ICMID.2018.8526995
  BibTeX: Download
• Hensel A., Schwarzer C., Scheetz M., Kaloudis M., Franke J.:
  Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations
  20th IEEE Electronics Packaging Technology Conference (EPTC) (Singapore, 4. Dezember 2018 - 7. Dezember 2018)
  In: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), NEW YORK: 2018
  DOI: 10.1109/eptc.2018.8654421
  BibTeX: Download
• Lomakin K., Pavlenko T., Ankenbrand M., Sippel M., Ringel J., Scheetz M., Klemm T., Gräf D., Helmreich K., Franke J., Gold G.:
  Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material
  In: IEEE Transactions on Components, Packaging and Manufacturing Technology (2018), S. 1-1
  ISSN: 2156-3950
  DOI: 10.1109/tcpmt.2018.2871931
  BibTeX: Download
• Neermann S., Scheetz M., Franke J., Roudenko J., Schirmer J., Reichenberger M.:
  Substrate pretreatments: an investigation of the effects on aerosol jet printed structures
  WGP-Jahreskongress
  DOI: 10.1007/978-3-030-03451-1_35
  BibTeX: Download